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    Machine-learning based wafer defect detection

    White Paper

    Machine-learning based wafer defect detection

    Failing to detect yield-killer defects could be due to the lack of sufficient understanding and modeling in terms of etching, CMP, as well as other inter-layer process variations. In this paper, we present a fast and accurate defect detection flow with machine learning (ML) methodologies to address the compounding effects from different process stages.

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