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    Technology Leadership Awards

    Technology Leadership Awards Winners Announcement

    The winners have been announced for the most prestigious design contest in PCB—the Technology Leadership Awards by Mentor, a Siemens Business

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    What's new in PCB

    See What’s New

    The latest VX.2.8 release of Mentor PCB products address the increasing complexity of today's advanced PCB designs.

    What's new in Xpedition

    What's new in IC Packaging Design

    What's new in HyperLynx

    Discovery Webinar Series

    Discovery Webinar Series

    Learn how to minimize risk with optimized systems verification methodologies

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    PCB Analysis and Verification Solutions

    Mistakes happen – find them faster with Mentor’s shift-left design methodology

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    Xpedition Enterprise

    Xpedition® Enterprise

    Integrated flow for the global enterprise, from system design definition to manufacturing execution

    Learn more about Xpedition

    Xpedition IC Packaging Design

    Xpedition IC Packaging Design

    Complete solution for High Density Advanced Package (HDAP) rapid prototyping assembly, physical design, verification, signoff, and modeling

    Learn more about Xpedition IC Packaging Design



    A complete suite of analysis and verification software which meets the needs of PCB engineers at any point in the board design flow

    Learn more about HyperLynx

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